Laboratory Dual-Rail Wafer Cutter, Glass and Silicon Wafer Cutting Tool, Diamond Blade Scribing Machine for Wafers and Chips (500 * 430mmDiamond Cutter Dicer)
$550.09
Price when purchased online
Free shipping
Free 30-day returns
Sold and shipped by elize.co.in
We aim to show you accurate product information. Manufacturers, suppliers and others provide what you see here.
$550.09
Price when purchased online
Free shipping
Free 30-day returns
Sold and shipped by elize.co.in
Free 30-day returns Details
Product details
| Management number | 220714578 | Release Date | 2026/05/03 | List Price | $220.04 | Model Number | 220714578 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Dual-Rail Design – Ensures stable and precise wafer cutting for various sizes.
- Diamond Blade – High-quality diamond blade for clean, accurate scribing.
- Versatile Use – Suitable for silicon wafers, glass substrates, and semiconductor chips.
- Laboratory-Grade – Ideal for research experiments and small-scale production.
- Adjustable Rails – Supports different wafer dimensions for flexible operation.
| Item Weight | 3.53 ounces |
|---|---|
| Manufacturer | XUSILAOK |
| Item model number | 500*430mmDiamond Cutter Dicer |
| Product Dimensions | 10.8 x 12 x 3 inches |
Bestseller ranking
General
Customers who viewed this product also viewed
All Lacrosse Equipment
Correction of product information
If you notice any omissions or errors in the product information on this page, please use the correction request form below.
Correction Request Form